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Products > Space & Component Technology > Electronic Components > Engineering and Design Support > Failure Analysis
Determine the root cause, eliminate future failures Failures in orbit can potentially cause billions of dollars in losses. When a failure happens during test, you need to determine the root cause, and not just the symptom. TCS Space & Component Technology has the technical resources including staff with decades of space component engineering experience and a vast network of laboratory capabilities, inside and outside TCS. We recognize the importance of performing all tasks necessary for a thorough failure analysis of any part type, active or passive. Because you can’t fix it in Space. When a device destined for space fails, it cannot simply be replaced—it must be analyzed to make sure that the replacement part will not have the same problem, or that a bad circuit design will not overstress the replacement part. TCS engineers have the experience with all high-reliability EEE component types and with failure analysis methodology and techniques to answer the two key questions: What happened? And what do we do about it? No analysis would include all of the possible analysis techniques, but TCS engineers understand which ones are appropriate and at what time in the investigation, to guide the user to a root cause and corrective action. Find the failure, before it happens: | Electrical testing (bench and automated) | Infrared thermal imaging and digital imaging | | Hermeticity testing: fine leak, gross leak, open-face | Bond strength (destructive and nondestructive) | | Die shear and probing | PIND testing and bit mapping | | SEM inspection and energy-dispersive spectroscopy | Cross sectioning, metallurgical and junction etching | | DLA certified RGA testing | Metallurgical analysis | | Radiography (real-time or wet-film x-ray, and n-ray | High and low magnification optical photo documentation | | Voltage contrast imaging | Photoemission miocroscopy | | Electron beam induced current (EBIC) analysis | Computed tomography (3D imaging) | | C-mode scanning acoustic microscopy (C-SAM) | Auger electron spectroscopy and other surface analysis | | Fourier transform infrared (FTIR) spectromotry and other organic analysis | Fractography and fracture mechanics |
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