|
 Products > Space & Component Technology > Advanced Products > Advanced Packaging Solutions
Designed right the first time When you need a custom package designed to meet your stringent requirements in the Military, Space or Industrial market, you should call on the Advanced Products Group (APG) at TCS. With over 35 years of experience in project management and custom packaging we can provide the solution that will best meet your needs for reliability, quality, and ruggedness. TCS combines the proven technologies listed below with robust design and testing to Military standards to meet your specific requirements. | Technology | Benefit | | Chip and Wire | Size, Extended Temperature Range, Ruggedness, Hermetic | | Chip-On-Board | Size, Weight | | Surface Mount Technology | Size, Weight, Cost | | Ball Grid Array | Size, Ruggedness | | FR4 | Cost | | BT | Extended temperature range | | Rigid-Flex | Size, Weight, Density | | Ceramic | Hermetic, Ruggedness, Thermal Management | TCS has in service custom designs in the military, spacecraft and avionics systems. Some of these applications include “System-in-a package”, memory modules, and custom multichip modules. Most applications require our AS9100 certification to meet the customer demands in their service locations.
|
 | Contact TCS
Space & Component
Technology
1-866-264-0793 | | | Contact Information |
Connections that Matter®
Dick Young, Executive VP & COO narrates video about TCS' offerings and markets. | | View larger on TeleComSysTV |
|
